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Trusted by teams that can’t afford failure
25
+
Years of Engineering service
500
+
Products developed
4
Engineering disciplines
DFM
Built into every design
ISO
9001 certified
Four disciplines. One integrated engineering team
Every discipline works together from day one so your electrical design informs your mechanical enclosure, your firmware
aligns with your hardware, and your test strategy is built in from the start.

Electrical & electronics engineering

We design circuits and PCB layouts with manufacturability built in from the first schematic selecting components aligned with availability, cost, and production realities. Every electrical design is reviewed for DFM before prototype, not after.

Circuit Design

Schematic design, component selection, power management, and signal integrity aligned with IPC standards and your application requirements.

PCB Layout & Design

Single and multi-layer PCB layout with DFM, DFT, and signal integrity constraints from simple single-sided boards to complex HDI designs.

Component Selection

Component selection aligned with manufacturability, cost, availability, and lifecycle with alternate sourcing recommendations built in.

Wire Harness Design

Harness schematic design, connector selection, and routing geometry engineered for assembly feasibility and compliance to IPC/WHMA-A-620.

Mechanical design

Our mechanical engineers work alongside electrical and firmware teams from day one, ensuring enclosures, thermal paths, and structural elements are designed for real-world manufacturing and assembly.

Enclosure design

Custom plastic and metal enclosure design considering PCB fit, connector placement, IP rating, and manufacturing method (injection moulding, sheet metal, or die cast).

Thermal management

Thermal simulation and design – heatsinks, airflow paths, thermal interface materials, and power dissipation analysis for products operating in demanding environments.

Structural design

Structural analysis aligned with real-world usage – vibration, shock, and mechanical load considerations for industrial, automotive, and outdoor applications.

DFA (design for assembly)

Mechanical assembly sequence review ensuring every enclosure can be assembled efficiently and consistently at production volume with minimal rework risk.

Embedded software development

Our embedded software team develops firmware and software that is aligned with the hardware design from day one not handed off at the end of the hardware cycle. That alignment is what makes our products work reliably in the field, not just in the lab.

Firmware development

C/C++ firmware development for microcontrollers and processors from bare-metal to RTOS-based implementations, aligned with hardware constraints and power requirements.

Board support packages (BSP)

BSP development for custom hardware – boot loaders, device drivers, and OS porting for Android, Linux, QNX, and other embedded operating systems.

Hardware-software integration

End-to-end integration of firmware with hardware – peripheral bring-up, driver development, communication protocol implementation, and system-level validation.

IoT & connectivity

Wireless connectivity implementation – Wi-Fi, Bluetooth, BLE, Zigbee, LoRa, and cellular protocols integrated with your hardware platform and cloud backend.Design for test (DFT)

Test engineering

Test engineering starts at design stage not after the board is built. Our test engineers review designs for testability (DFT), develop test strategies, and build custom test fixtures and software so that quality verification is fast, reliable, and scalable from prototype to production.

Design for test (DFT)

DFT review at schematic and layout stage ensuring test point placement, ICT access, and boundary scan capability are built in before the first prototype is built.

Test fixture design

Custom in-circuit test (ICT) and functional test (FCT) fixture design and build developed in-house for your specific board design and test requirements.

Validation planning

Structured validation plans covering functional, environmental, and compliance testing mapped to your target industry’s standards and certification requirements.

Test automation

Automated test script development and test framework implementation reducing manual test time, improving repeatability, and enabling data-driven quality decisions.

Electrical & electronics engineering
+

We design circuits and PCB layouts with manufacturability built in from the first schematic selecting components aligned with availability, cost, and production realities. Every electrical design is reviewed for DFM before prototype, not after.

Circuit Design

Schematic design, component selection, power management, and signal integrity aligned with IPC standards and your application requirements.

PCB Layout & Design

Single and multi-layer PCB layout with DFM, DFT, and signal integrity constraints from simple single-sided boards to complex HDI designs.

Component Selection

Component selection aligned with manufacturability, cost, availability, and lifecycle with alternate sourcing recommendations built in.

Wire Harness Design

Harness schematic design, connector selection, and routing geometry engineered for assembly feasibility and compliance to IPC/WHMA-A-620.

Mechanical design
+

Our mechanical engineers work alongside electrical and firmware teams from day one, ensuring enclosures, thermal paths, and structural elements are designed for real-world manufacturing and assembly.

Enclosure design

Custom plastic and metal enclosure design considering PCB fit, connector placement, IP rating, and manufacturing method (injection moulding, sheet metal, or die cast).

Thermal management

Thermal simulation and design – heatsinks, airflow paths, thermal interface materials, and power dissipation analysis for products operating in demanding environments.

Structural design

Structural analysis aligned with real-world usage – vibration, shock, and mechanical load considerations for industrial, automotive, and outdoor applications.

DFA (design for assembly)

Mechanical assembly sequence review ensuring every enclosure can be assembled efficiently and consistently at production volume with minimal rework risk.

Embedded software development
+

Our embedded software team develops firmware and software that is aligned with the hardware design from day one not handed off at the end of the hardware cycle. That alignment is what makes our products work reliably in the field, not just in the lab.

Firmware development

C/C++ firmware development for microcontrollers and processors from bare-metal to RTOS-based implementations, aligned with hardware constraints and power requirements.

Board support packages (BSP)

BSP development for custom hardware – boot loaders, device drivers, and OS porting for Android, Linux, QNX, and other embedded operating systems.

Hardware-software integration

End-to-end integration of firmware with hardware – peripheral bring-up, driver development, communication protocol implementation, and system-level validation.

IoT & connectivity

Wireless connectivity implementation – Wi-Fi, Bluetooth, BLE, Zigbee, LoRa, and cellular protocols integrated with your hardware platform and cloud backend.Design for test (DFT)

Test engineering
+

Test engineering starts at design stage not after the board is built. Our test engineers review designs for testability (DFT), develop test strategies, and build custom test fixtures and software so that quality verification is fast, reliable, and scalable from prototype to production.

Design for test (DFT)

DFT review at schematic and layout stage ensuring test point placement, ICT access, and boundary scan capability are built in before the first prototype is built.

Test fixture design

Custom in-circuit test (ICT) and functional test (FCT) fixture design and build developed in-house for your specific board design and test requirements.

Validation planning

Structured validation plans covering functional, environmental, and compliance testing mapped to your target industry’s standards and certification requirements.

Test automation

Automated test script development and test framework implementation reducing manual test time, improving repeatability, and enabling data-driven quality decisions.

Tools & Platforms
From brief to production-ready with fewer surprises.
Every engineering programme follows a structured process with cross-discipline collaboration at every stage so issues
surface early, not after tooling is committed.

We align on your product brief, application context, target volumes, regulatory requirements, and constraints with all four engineering disciplines in the room so every decision is made with full visibility.

System architecture defined across electrical, mechanical, and software with a DFM and DFT review built into the concept stage so manufacturing constraints shape the design from the start.

Detailed electrical, mechanical, and firmware design followed by rapid prototype builds to validate performance, form factor, and manufacturability before committing to production tooling.

Designs are tested for functionality, reliability, and compliance using test fixtures and validation plans developed by our test engineering team to ensure every unit meets spec before production begins.

A fully validated, documented design package handed to production with DFM sign-offs, test specifications, BOM, and manufacturing instructions in place for a seamless transition to the production floor.
Engineering for industries where
precision is non-negotiable
Why design with a manufacturing-first
engineering partner?
Most design firms hand off to a manufacturer. We are the manufacturer which
changes how every engineering decision gets made.
01
All four disciplines under one roof
Electrical, mechanical, embedded software, and test engineering working as one integrated team - not four separate consultants handing off to each other.
02
Design and manufacturing under one roof
Your design engineer and your production line work in the same ecosystem so DFM inputs are real, actionable, and based on the actual equipment your product will be built on.
03
Fewer redesign cycles
DFM, DFT, and DFA built into every design decision from day one so issues surface at the sketch stage, not the production stage where they cost 10x more to fix.
04
Faster NPI and time to market
Dedicated NPI resources and parallel workstreams - your design, firmware, test fixtures, and production process developed simultaneously, not sequentially.
05
25+ years of manufacturing experience behind every design
Our engineering team carries decades of cross-industry knowledge - every component selection, layout decision, and firmware architecture informed by real production experience.
06
Seamless transition to production
When your design is ready, the same team hands it to production - no knowledge transfer to a new partner, no gaps in accountability, no lost context.
Full product development from circuit design to
production-ready in 14 weeks
Problem
An industrial IoT startup needed to take their product from concept to production-ready design covering PCB design, enclosure, firmware, and test fixtures but had no in-house engineering team and had previously lost 6 months to a design firm that had no manufacturing connection.
Solution
Our engineering team took on the full programme - circuit design, PCB layout with DFM, enclosure design, FreeRTOS firmware development, and test fixture build, all running in parallel with weekly cross-discipline alignment.
Outcome
Production-ready design delivered in 14 weeks. Zero DFM issues flagged at pilot run. Client moved directly to production with the same JINST team.
14-week concept to production-ready · zero pilot run issues
Have a product idea or an engineering challenge?
Tell us about your product and our engineering team will review and respond within 24 hours.