IoT and IIoT products demand compact PCB designs, wireless connectivity integration, firmware loading at scale, and increasingly ruggedised builds for industrial field deployment. We supports IoT hardware programmes from NPI through to high-volume production with firmware flashing, serialisation, and direct fulfilment capability built in.
Fine-pitch SMT for high-density IoT boards with RF and connectivity components.
Fine-pitch SMT for high-density IoT boards with RF and connectivity components.
Fine-pitch SMT for high-density IoT boards with RF and connectivity components.
Box build with IP67/68 sealing for industrial and outdoor IoT deployments.
Security hardware must be reliable 24/7, often in outdoor or semi-exposed environments, with firmware that must be loaded and verified before deployment. We manufacture security electronics assemblies with the testing rigour, firmware capability, and environmental protection that always-on security applications require.
SMT assembly for camera, sensor, and controller boards at any volume.
Device configuration, firmware flashing, and functional test before despatch.
Complete assembly of security hardware into finished, field-ready units.
Conformal coating and IP-rated builds for outdoor security deployments.
Robotics and autonomous systems combine high-density electronics, power electronics, wire harnesses, and real-time firmware often in compact, ruggedised form factors that must perform reliably under continuous mechanical stress. Our ability to manufacture PCBs, power harnesses, and box builds under one roof makes us well-suited to robotics programmes with complex multi-discipline manufacturing requirements.
High-reliability mixed-technology PCBs for motor controllers and servo drives.
Flexible, high-flex harnesses for robot arms and moving system components.
Multi-sensor PCB assembly with high-precision placement and calibration support.
Complete electromechanical integration for robot controller enclosures.
Edge computing and AI hardware demand high-density, thermally demanding PCB assemblies with complex power delivery and high-speed signal integrity requirements. We support computing hardware programmes with fine-pitch BGA assembly, thermal management expertise, and the quality systems that data centre and AI infrastructure customers require from their manufacturing supply chain.
Fine-pitch BGA and multi-layer board assembly with X-ray verification.
High-current power delivery PCBs with load testing and burn-in.
Heatsink integration, TIM application, and thermal validation for compute hardware.
Board-level and system-level assembly for edge and data centre deployments.